USHIO has begun shipping a 200 mm wafer full-field projection lithography tool that aids in developing high-brightness LED chips.
The company has also completed developing a laser lift-off solution to manufacture vertical-structure LED chips. It is exhibiting the UX4-LEDs LLO 150 laser lift-off system at the SEMICON West 2011 Expo that is taking place in San Francisco.
The UX4-LEDs FFPL 200 lithography tool can be mounted on a UX4-LED platform by using a projection lens that measures 200 mm in diameter. The tool, in addition to attaining a throughput of 120 wafers every hour, also utilizes the full-field projection technique to improve the productivity by enhancing the size of the wafer. This enables users to enhance productivity and decrease the Cost-of-Ownership in the lithography procedure. The tool is completely non-contact and does not cause any mask damage. It also features a special alignment technology that is used for low visibility alignment markings. The lithography tool has a backside alignment function that aids LED wafer –level packaging applications.
The UX4-LEDs LLO 150 laser lift-off system processes 150 mm sapphire substrates and allows reuse of sapphire substrates. It attains high throughput and high yield and decreases the LED manufacturing expense significantly.