Semiconductors News

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OFC 2015: Credo Announces Demonstrations of 56G NRZ Solutions

Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it is demonstrating the industry's first 56G NRZ SerDes as part of the Optical Internetworking Forum (OIF) Technology Showcase (Booth #613). Together with solutions from other industry participants, the Credo 56G NRZ SerDes will drive three live demonstrations: a CEI-56G-VSR-NRZ channel, a CEI-56G-MR/LR-NRZ backplane and a CEI-56G-MR-NRZ passive copper cable.

25 Feb 2015

PIXELTEQ Expands Operations and Takes on New Team Members at Florida Facility

PIXELTEQ has completed a major expansion and upgrade at its Largo, Florida operation to accommodate growing demand for the company’s innovative OEM spectral sensor and micro-patterned filter solutions.

4 Feb 2015

ESI Debuts CornerStone UV Laser Drilling System for Integrated Circuit Packaging Applications

Electro Scientific Industries, Inc., a leading supplier of innovative laser-based manufacturing solutions for the micro-machining industry, today introduced the CornerStone™ ICP Series 1 UV laser drilling system designed for use initially in Integrated Circuit Packaging (ICP) applications.

13 Jan 2015

GSA Honors Ambarella with Most Respected Emerging Public Semiconductor Company Award

Ambarella, Inc., a leading developer of low-power, HD and Ultra HD video processing semiconductors, today announced that the Global Semiconductor Alliance (GSA) has honored the Company with the award for “Most Respected Emerging Public Semiconductor Company (achieving $100 to $250 million in annual sales).”

15 Dec 2014

Global Market for Optical Network Semiconductors Expected to Reach About $7.6 Billion by 2019

The global market for optical network semiconductors reached roughly $6.0 billion in 2013 and increased to about $6.4 billion in 2014. The market is expected to reach about $7.6 billion by 2019, registering a compound annual growth rate (CAGR) of 3.2% from 2014 to 2019.

24 Nov 2014

Samsung Electronics Unveils New Chip-on-Board LED Package Products

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package products, the LC006B and LC008B, with six and eight watts of power respectively. The new packages join five others in Samsung’s popular LC series (LC013B, LC019B, LC026B, LC033B and LC040B), to complete its COB package line-up.

13 Nov 2014

New Toshiba TC358791XBG Companion Chip Supports Latest Automotive Gigabit Ethernet AVB Standard

Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today launched a key new addition to its extensive portfolio of solutions for the automotive market.

25 Oct 2014

Semicoa Completes Testing of Laser Marking Technology for Hermetic Packaged Discrete Semiconductor Devices

Semicoa, a trusted supplier of high reliability discrete semiconductors for avionics, aerospace, space and defense applications, has completed an extensive seven month research and testing program for advanced technology relating to laser marking of hermetic packaged discrete semiconductor devices.

From SEMICOA 7 Oct 2014

Physicist Develop Ultra-Fast Semiconductor Nano-Lasers

Physicist at the University of Jena together with colleagues from Imperial College London develop ultra-fast semiconductor nano-lasers. As the researcher report in the current issue of the journal of "Nature Physics", they are capable of producing the fastest lasers to date (DOI: 10.1038/NPHYS3103).

30 Sep 2014

LightPointe Announces Shipping of New Aire X-Stream FSO Solution

LightPointe, the leading manufacturer of Gigabit capacity outdoor point-to-point data bridges, is now shipping the new Aire X-Stream FSO solution optimized for telecom networks, which due to the exponential growth of mobile data, video, and voice applications require extremely fast and reliable wireless backhaul infrastructure.

17 Sep 2014

Featured Equipment

Advanced F-Theta Lenses for Precision Imaging Systems

These F-theta lenses by Avantier are designed for consistent spot size and uniform field curvature correction, ideal for high-resolution imaging applications.

From Avantier Inc.

Off-Axis Parabolic (OAP) Mirrors: Precision Solutions for Advanced Optical Systems

Shanghai Optics provides high-precision off-axis parabolic (OAP) mirrors designed for advanced optical systems, offering superior reflective solutions for applications requiring precise light collimation and focus.

From Shanghai Optics