Nov 9 2009
Advanced Technology Improves Performance, Reliability and Environmental Sustainability
Dow Electronic Materials will introduce its new line of products for printed circuit board (PCB) manufacture at this year’s Productronica show (Stand 305, Hall 2, New Munich Trade Fair Center, Germany) on November 10-13. These new products improve performance and reliability, and help meet the electronics industry’s requirements for miniaturization, enhanced performance, reduced costs, and reduced environmental impact.
For PCB Imaging, LAMINAR™ UD-900 Dry Film photoresist for laser direct imaging has demonstrated capability in a wide range of plating and etching applications. PHOTOPOSIT™ SN68 Photoresist is a robust, high-yielding, fine line, cost effective photoresist that can be utilized in manual and automatic exposure equipment at optimum productivity levels. LITHOJET™ Inkjet Materials offer print and etch solutions while significantly reducing waste generation; for some customers, use of these materials may result in waste generation reduction of up to approximately 85 percent. LITHOJET™ 210 Etch Resist is a new UV-curable acrylic hybrid ink that can dramatically improve yield and quality, as well as reduce manufacturing cost.
For PCB Making Holes Conductive, CIRCUPOSITTM 3000-1 Electroless Copper is a universal plating through hole process capable of low build or high build, basket or rack, and vertical, conveyorized vertical or horizontal applications.
For PCB Electrolytic Plating, MICROFILLTM EVF Copper Via Fill addresses the demand for high density interconnect products using filled microvias: fast filling at low surface copper is achieved. For conventional through hole plating, COPPER GLEAMTM HT-55 Copper Electroplate provides exceptional surface distribution and throwing power.
For PCB Final Finish, Dow Electronic Materials continues to invest in the development of new solderable final finishes for the PCB market and extends its product offering with SILVERONTM MF 100 Autocatalytic Silver. This new product offers a true multi-functional finish for reflow or wire bond without nickel or thick gold. It also compliments our existing electroless nickel immersion gold and electroless nickel electroless palladium immersion gold processes using DURAPOSITTM SMT 88 Electroless Nickel; PALLAMERSETM SMT 2000 Electroless Palladium and AUROLECTROLESSTM SMT Immersion Gold.
"The market drive for miniaturization, enhanced performance, reduced environmental impact and lower costs marches onwards,” said Bob Ferguson, global general manager for Dow Electronic Materials. “Dow Electronic Materials is committed to developing technology that improves performance, reliability and sustainability for the PCB industry. Our leading technologies, excellent customer support and extensive global footprint enable us to keep on delivering next generation solutions for the electronic market,” he said.
Source: http://www.dow.com/?linksource=em_nr_110909