Advanced APS2 measurement technology incorporates a wider range of particle sizes in sensors that speed processes and improve yields
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announced it will showcase its next-generation Airborne Particle Sensor technology (APS2) with an extended particle size range at the upcoming SEMICON Japan in Tokyo, Dec. 14-16, 2016 in booth #4605.
CyberOptics’ APS2 portfolio speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. The next-generation APS2 provides even greater versatility, with the industry-leading accuracy and sensitivity valued by semiconductor fabs and equipment OEMs worldwide.
Both the WaferSense® and ReticleSense® Airborne Particle Sensors (APS2, APSR and APSRQ) can measure small and large particles. The new large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.
We’re excited to demonstrate our APS2 devices with large particle capability in Japan, where the world’s largest installed fab capacity is more than 4.1 million (200mm equivalent) wafers per month*. We’ve added this desired functionality to our devices that are recognized as the Best Known Method for wireless airborne particle sensing in semiconductor fabs.
Mr. Yukinobu Hayashi, Sr. Field Applications Engineer, CyberOptics.
At SEMICON Japan, CyberOptics will also demonstrate its WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device. The thin and light form factor enables the AMS to travel through virtually any tool and the AMSR can capture multiple measurements in all locations of the reticle environment. The all-in-one devices are yet another way to increase yield and reduce downtime in semiconductor environments.
About the WaferSense and ReticleSense Line
The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS), the Airborne Particle Sensor (APS), the advanced Airborne Particle Sensor (APS2) and the new Auto Multi Sensor (AMS) are available in various wafer shaped form factors depending on the device, including 150mm, 200mm and 300mm wafer sizes. The ReticleSense measurement portfolio including the Airborne Particle Sensor (APSR & APSRQ) and next-generation APS2, the Auto Leveling System (ALSR) and the Auto Multi Sensor (AMSR) are available in a reticle shaped form factor.
For more information about the entire line of CyberOptics solutions please visit www.cyberoptics.com.