MACOM Introduces First Chip-Set Optimized for Onboard 100Gbps Optical Transceivers

MACOM Technology Solutions Inc., a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, today announced the MALD-37345, a quad 28G VCSEL driver with input equalizer, and the MATA-37344, a quad 28G transimpedance amplifier. This complete transmit/receive solution is targeted for short reach, VCSEL based 100Gbps onboard optics, but also suited for optical modules and active optical cable applications.

This chipset addition to MACOM’s portfolio of short reach VCSEL drivers and TIAs is a next generation evolution of currently shipping MALD-37045 and MATA-37044, with the new chipset eliminating the need for Clock Data Recovery (CDR). This new chipset is backwards pin compatible with MACOM’s industry leading MALD-37045 and MATA-37044 devices, enabling customers with the ability to mix and match parts to include or not include a CDR for extreme flexibility.

“We extended our existing portfolio of VCSEL drivers and TIAs with the additions of the MALD-37345 and MATA-37344. These devices, while optimized primarily for on-board optics, are still able to support active optical cables and optical modules,” said Marek Tlalka, Director of Product Marketing at MACOM. “By eliminating the need for the clock and data recovery circuitry present in its predecessors, this chipset enables our customers to deliver ultra-low power and low cost transceivers that can be placed close to host ASICs for intra system optical connectivity. Additionally, with its compatibility to our existing MALD-37045 and MATA-37044 devices including CDR, the new chipset is a truly versatile solution for customers.”

The VCSEL driver of the MALD-37345 includes programmable eye-shaping features and an input equalizer. The high-sensitivity TIA of the MATA-37344 features selectable bandwidth to support up to 28.05Gbps and lower speed legacy data rates, as well as an output driver with programmable output swing and 2-tap de-emphasis. Both devices are available in 2 mm x 3 mm die form, supplied in waffle packs, whole wafers or quartered wafers.

“Increasing data rates on the PCBs creates signal integrity and thermal constraints due to concentration on the optical IO at the front panel,” said Simon Stanley, Founder and Principal Consultant at Earlswood Marketing Ltd, and Analyst at Large with Heavy Reading. “By placing a transceiver close to the host ASIC, these constraints are alleviated. MACOM’s chip-set is enabling the deployment of 100Gbps onboard optical transceivers.”

MACOM’s portfolio of VCSEL drivers and TIAs will be shown at ECOC 2016, Booth #645, September 19th-21st at the Congress Center in Dusseldorf, Germany. To make an appointment, contact your local sales representative. For more information on MACOM’s broad optical and photonic portfolio visit: www.macom.com.

Source: http://www.macom.com/

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