M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, today announced a private technology demonstration at OFC 2016, featuring a complete electronics chip-set utilizing PAM-4 technology and enabling a 56Gbps per lane data rate.
This featured IP demonstrates another facet of MACOM’s advanced chipset solution for 200G and 400G optical connectivity in both parallel single mode fiber (PSM) and wave division multiplexing (WDM) applications.
MACOM’s technology demonstration achieves industry leading transimpedance amplifier (TIA) sensitivity and low power, which enables the development of 200G QSFP and 400G MSA optical modules. On the transmit side, MACOM’s demonstration will feature a 28Gbaud linear driver and Clock and Data Recovery (CDR). The signal will be transmitted over single mode fiber, and recovered on the receiver side using MACOM’s 28Gbaud TIA and retimed with MACOM’s receiver CDR.
“MACOM has achieved excellent performance in silicon through its 28Gbaud PAM-4 chipset IP. This technology, along with recently announced L-PIC™ silicon photonics and our CW lasers, will enable next generation 200Gbs and 400Gbs solutions for small form-factor optics,” said Preet Virk, Senior Vice President and General Manager, Networks, MACOM. “We anticipate that our complete chipset and laser solutions for PAM-4 technology will build on our success at 100Gbps and enable the next generation of 200G and 400G optical connectivity for enterprise and datacenter applications,” “Based on this technology, MACOM is now engaged with customers on the development of commercial products with projected industry leading performance to sample later this year.”
MACOM’s complete PAM-4 based optical link demonstration, will be on display at OFC 2016, Booth #3101, March 22-24th in Anaheim, CA. To make an appointment, contact your local sales representative. For more information on MACOM’s broad optical and photonic portfolio visit: www.macom.com.