New Report on Global Markets for On-Chip and Chip-to-Chip Optical Interconnects

Research and Markets has announced the addition of the "Markets for On-Chip and Chip-to-Chip Optical Interconnects - 2015 to 2024" report to their offering.

The so-called interconnect bottleneck is creating opportunities for optical device and cable makers or all kinds. Process scaling, power consumption and operating frequency have all need to move away from metal interconnects and into the optical realm. This need is increasing with each new node; in high performance processors with metal tracks, clock distribution alone can use up to 50% of total chip power.

In this report, the author analyzes both the latest commercial developments in optical interconnection at the chip level (both on-chip and chip-to-chip) and the progress in this area that is being made by important research teams worldwide. The coverage includes an investigation into the very latest architectures, devices, and materials that are impacting the prospects for on-chip and chip-to-chip optical connection. Among the topics covered by the report are the following:

  • The rise of optical engines and how these fit into future chip-to-chip connectivity. How will the architectures of these devices and materials used change as device dimensions shrink and what is the revenue potential of optical engines over the next ten years
  • An assessment of how novel photonic devices will be used in on-chip/chip-to-chip connections, analyzing the market potential of compound semiconductors versus the silicon photonics approach.
  • The market for approaches to optical interconnection that uses novel materials. Polymers, a material that has a long history, may finally find a role. Possible roadmaps for optical interconnection that use carbon nanotubes are also considered.
  • The commercialization of CMOS compatible optical interconnection using 3D architectures and other solutions

This report also contains a 10-year analysis that quantifies where and when the commercial opportunities for optical interconnection at the chip level will emerge and how much they will be worth. We also profile the leading firms and research efforts involved in designing and implementing on-chip and chip-to-chip optical interconnection.

The author has been tracking the market for optical interconnects for almost a decade and is the leading industry analyst firm providing coverage in this this area. The report will be of considerable interest to marketing managers, business development executives and product managers in the semiconductor and data communications industries. It will also be of use to serious investors in these and other related industries.

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