Apr 9 2014
Research and Markets has announced the addition of the "Global On-Chip and Chip-to-Chip Optical Interconnects Market Forecasts & Opportunities 2013-2020 " report to their offering.
The report covers four kinds of chip-level interconnect: optical engines, photonic integrated circuit (PIC)-based interconnects, silicon photonics and free-space optics. It includes nine-year (volume and value) forecasts with breakouts by active components along with fiber and waveguide transmission media. Compound semiconductor, silicon and polymer waveguides are covered, as are VCSELs, silicon lasers and quantum dot lasers. In addition, the report contains assessments of the latest business and technology strategies in the chip-level optical interconnect space.
Companies discussed in this report include
- Avago
- Cisco
- Corning
- Dow Chemical
- Dow-Corning
- DuPont
- Finisar
- Fujitsu
- Furukawa
- IBM
- Intel
- Juniper
- Kotura
- Micron
- Novellus
- Optical Interlinks
- QD Laser
- Reflex Photonics
- Samtec
- Sumitomo
- TeraXion
- Tokyo Electron
- ULM Photonics
- VI Systems.
From the Report:
The growing popularity of parallel computing, and the arrival of multicore processors and 3D chips are leading to data traffic jams both on-chip and chip-to-chip. However, the report believes that these trends are also creating opportunities for chip-level optical interconnects.
Avago, Finisar, IBM and Samtec have all proposed optical engines for chip-level interconnect. These miniaturized optical assemblies are currently the most mature technology available for this application and will generate revenues of $235 million in 2019. However, with their attached connectors and heat sinks, optical engines may prove too large for complex optical interconnection environments, such as in the coming generation of Exascale supercomputers.
Key Topics Covered:
Executive Summary
E.1 "Interconnect Bottleneck" Spells Opportunities for the Photonics Industry
E.2 Challenges for Chip-Level Optical Interconnection
E.3 Roadmap Considerations and Summary 10-year Forecast for Chip Level Interconnection
E.4 Two Companies to Watch: IBM and Intel
Chapter One: Introduction
Chapter Two: Analysis of Demand for On-Chip/Chip-to-Chip Interconnection
2.1 Megatrends Driving the Need for Optical Interconnect at All Levels
2.2 Chip-to-Chip and On-Chip Interconnect: Replacing Copper
2.3 Limits to Electronic Interconnects
2.4 Drivers and Threats for Optical Interconnect
2.5 Moore's Law, Scaling and Interconnect
2.6 Multicore Processing and Interconnect
2.7 3D Chips and Interconnect
2.8 A Possible Transition to Optical Computing and Communications: Interconnect Implications
2.9 Potential for Moving to Nanocarbon Computers
Chapter Three: Technologies for On-Chip/Chip-to-Chip Interconnect
3.1 Future Technologies for Chip-Level Interconnect
3.2 VCSELs for Interconnect: Getting Faster
3.3 Silicon Lasers
3.4 Quantum Dot Lasers
3.5 Optical Engines
3.6 The Role of Optical Integration in Future Chip-Based Interconnection
3.7 Silicon Photonics
3.8 Opportunities for Fiber, Waveguides and Free-Space Optics in Chip-Level Interconnect
3.9 Use of Carbon Nanotubes and Graphene for Chip-Level Optical Interconnect
For more information visit http://www.researchandmarkets.com/research/k79dvr/revenue
Source: http://www.researchandmarkets.com/