Feb 5 2010
Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has received a follow-on, multiple-system order for its laser spike anneal (LSA) tools from a major foundry in Asia.
Ultratech's LSA100A systems will be used to support high-volume production for advanced logic devices in 2010. Based on Ultratech's proprietary long-wavelength annealing technology, the LSA100A provides significant cost of ownership, process uniformity, and process control advantages that make it an ideal tool for foundry manufacturing. Ultratech's LSA tools are currently being used in all major logic foundries.
Ultratech's Vice President of Laser Product Marketing, Jeff Hebb, Ph.D., noted, "Our foundry customers require a cost-effective, advanced annealing solution that has the flexibility to process many different product layouts while maintaining high product yields. The unique technology of the LSA100A system has demonstrated that it can meet these critical requirements in a foundry environment, and is also extendible to the next two technology generations. Our LSA system provides uniform temperature and uniform process results that are independent of the device layout. As a result, our foundry customers can feel confident that they will not experience yield issues when transferring LSA processes to new product designs, as many have done already. This follow-on, multi-system order further confirms the LSA100A system provides a low-risk solution for the foundries' advanced annealing requirements."
Source: http://www.ultratech.com/