Nov 3 2009
DuPont Microcircuit Materials (MCM) announced the introduction of the DuPont™ GreenTape™ 9K7 low temperature co-fired ceramic (LTCC) material system, designed for advanced high-frequency, microwave and millimeter wave electronic circuit applications within the aerospace, automotive, military, consumer electronics and telecommunications industries.
DuPont™ GreenTape™ 9K7 LTCC material is a lead-free glass-ceramic dielectric tape, and is available with compatible gold and silver conductive materials as well as co-fired embedded resistor materials. MCM continues to expand its portfolio of LTCC and other materials systems which combine superior performance with preferred environmental properties.
“DuPont™ GreenTape™ 9K7 is ideal for electronic system designs which need to deliver a high-density, low-loss, cost-effective interconnect and packaging solution that performs with exceptionally high reliability,” said Scott Gordon, Americas regional marketing manager – DuPont Microcircuit Materials. “It’s also more robust in processing, with a stable dielectric constant even when refired, which for fabricators translates into greater consistency and higher yields for final circuits. These properties make GreenTape™ 9K7 a unique solution for leading-edge applications requiring RF and microwave frequencies, such as bluetooth, automotive safety radar systems and transceivers.”
LTCC technology has long provided circuit designers with the ability to further miniaturize high-density interconnect circuits, but the development of a new proprietary crystallizable glass, with alumina fillers for added mechanical strength, has been a significant technical breakthrough with GreenTape™ 9K7. With this system, circuit designers and LTCC fabricators now have the ability to design and build high-frequency microwave circuits up to 100 Gigahertz and beyond, using electronic materials that are improved over other commercial tape systems, demonstrating superior dielectric properties and improved process capability. All components of the DuPont™ GreenTape™ 9K7 LTCC system are compatible, to facilitate their introduction into the manufacturing process.
DuPont will present this new offering, along with its full portfolio of microcircuit materials, at the IMAPS 2009 – 42nd International Symposium on Microelectronics, Nov. 1 – 5 in San Jose, Calif. Two key technical papers on LTCC technology will also be presented as part of the technical program at IMAPS on Tuesday, Nov. 3, 2009: “Characterization of DuPont™ GreenTape™ 9K7 LTCC Materials System for Radio Frequency/Microwave Packaging Applications;” and “New Plateable Thick Film Silver Conductors for DuPont™ GreenTape™ 951 LTCC Systems
Source: http://www2.dupont.com/MCM/en_US/