Jun 24 2010
SinkPAD has introduced the new thermal management printed circuit board (PCB) for the applications in LED cooling. The SinkPAD technology used for aluminum IMS PCB enhances the thermal management in the LED devices.
However, the technology is more effectual in high-bright, high-power surface mounted LEDs, which do not have the capability to dissipate heat and are not suitable for commercialization.
Sectional View of SinkPAD Metal Substrate
By providing a thermal path between the atmosphere and the LED, the SinkPAD makes the heat to be conducted out from the LED system. This helps to remove the thermal resistance, which was produced by the dielectric material in a conventional MCPCB or IMS PCB. The SinkPAD design completely eliminates the material that has the maximum thermal resistance from the system structure. The SinkPAD utilizes a dielectric that electrically isolates the metal base. Then it leaves the metal base thermally connected. To solder the LED to the SinkPAD directly, the thermal path in the LED package must be electrically neutral.
Source: http://www.sinkpad.com/