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Inphi Expands 45GBaud Linear Coherent Product Family with Launch of New SMT Quad Linear Driver

Inphi Corporation, a leading provider of high-speed connectivity solutions, introduces the IN4517SZ, a quad linear differential to single-ended Mach-Zehnder Modulator Driver in a Surface Mount Technology (SMT) package.

17 Mar 2016

Lightwave Innovation Reviews Program Recognizes OFS Fiber Optic Products

OFS, a leading edge designer, manufacturer and supplier of innovative fiber optic network solutions, announced today that two of its products are being recognized by the 2016 Lightwave Innovation Reviews.

16 Mar 2016

II-VI Announces Exhibition of Broad Portfolio of Optical Communication Products at OFC 2016

II]VI Incorporated, a leading provider of solutions for next generation optical networks, today announced that it will be exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) in Anaheim, California, on March 22-24, 2016, in Booth # 3809.

16 Mar 2016

OFC 2016 to Feature Coriant’s Latest Multi-layer Packet Optical Transport Solutions

Coriant, a global supplier of SDN-enabled end-to-end transport networking solutions, today announced that it will showcase the latest advances in its expanded portfolio of multi-layer Packet Optical Transport Solutions at OFC 2016 in Anaheim, California from March 22-24. Coriant OFC 2016 demonstrations will feature a broad range of OpEx- and CapEx-optimized solutions for evolving cloud and data center-centric transport networks.

16 Mar 2016

OFC 2016 to Feature Latest Vishay Electro-Films Solutions

Vishay Intertechnology, Inc. today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2016 Optical Fiber Communications Conference and Exhibition (OFC 2016), taking place March 20-24 at the Anaheim Convention Center in Anaheim, California. In booth 2712, products on display will include a wide range of Vishay EFI custom submounts, custom substrates with sidewall patterning, high-performance RF capacitors, and wire-bondable devices.

14 Mar 2016

ADVA Optical Networking Announces Successful Verification of Key Products in EANTC Interoperability Tests

ADVA Optical Networking announced today that the European Advanced Networking Test Center (EANTC) has verified the interoperability of key products in its demarcation and synchronization portfolio. The NETCONF/YANG and the OpenFlow interface of the ADVA FSP 150 Carrier Ethernet demarcation technology were proven in a multi-vendor interoperability showcase.

14 Mar 2016

NASA Selects Ball Aerospace to Deliver Concept Study for WFIRST Observatory

Ball Aerospace & Technologies Corp. has been selected by NASA to deliver a concept study for the Wide Field Infrared Survey Telescope (WFIRST) Wide Field Instrument (WFI), the agency's next major astrophysics project to follow the 2018 launch of the James Webb Space Telescope.

14 Mar 2016

Molex’ Nano-Pitch I/O 80-Circuit Interconnect System for SAS and PCI Express Applications

At DesignCon 2016, Molex, LLC introduced the Nano-Pitch I/O™ 80-Circuit Interconnect System, which offers the highest port density (number of high-speed differential lanes) and speed (25 Gbps per lane) in the smallest package available. A multi-protocol pinout concept enables compatibility with all known SAS, SATA and PCIe protocols and provides enhanced signal integrity in an extremely compact form factor. The connector is ideal for SAS and PCI Express applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile/enterprise.

11 Mar 2016

OFC 2016: Teledyne LeCroy, Anritsu, Coherent Solutions and Oclaro to Demonstrate Latest 400G Test Platform

Teledyne LeCroy, Anritsu Company, Coherent Solutions Ltd. and Oclaro, Inc. today announced a new joint effort to demonstrate the highest performance single-carrier 16QAM signal generation and analysis capabilities available at 56Gbaud. The demonstration of the partners' latest optical communications test equipment platform takes place at OFC 2016 in Anaheim, CA, USA in the Teledyne LeCroy booth #1115.

10 Mar 2016

M/A-COM Technology Solutions Debuts Silicon Photonic IC Integrated with Lasers, MAOP-L284CN

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, today announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.

9 Mar 2016

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