Dec 2 2016
"SCREEN Semiconductor Solutions Co., Ltd. (SCREEN) and Leti, a CEA Tech institute, today announced they have stepped up their collaboration with the installation at Leti's site of a nanosecond-scale UV laser anneal LT-3100 system to be delivered by Laser Systems and Solutions of Europe (LASSE), SCREEN's subsidiary based in France".
"The introduction of SCREEN's nanosecond-scale UV laser anneal tool in Leti's leading-edge, pre-industrial equipment infrastructure will open new innovation opportunities for current and future technology being developed on site," said Leti CEO Marie Semeria. "With SOI, CoolCubeTM and nanowire technologies development, we are facing increased challenges in developing new material property and ultra-thin-film modification with minimal thermal impact. Leveraging the LT-3100 system will enable solutions for technology breakthroughs that will eventually lead to the development of practical demonstrators for industry."
"Following a long history of successful joint developments with Leti, we are very excited by the opportunity to bring our laser technology to Leti's ecosystem to support 'More than Moore', IoT and future innovation technology requirements," said Tadahiro Suhara, president of SCREEN Semiconductor Solutions. "In addition to the collaboration activities, we will use Leti's state-of-the-art infrastructure to operate our LASSE European demo lab, giving our customers unprecedented demonstration infrastructure capability. We expect to showcase the innovation value that our nanosecond-scale UV laser-equipment technology and resources bring to advance semiconductor process development in multiple fields of research and development as supported by Leti."
The Laser tool is expected to be fully operational in the first half of 2017 and will support multiple wafer size requirements to meet the different needs of Leti's laboratories.
Source: http://www.screen.co.jp/