Sep 30 2010
Provider of laser-processing systems, Ultratech announced that it has obtained a multiple-system order from a logic foundry in Asia, for its laser spike annealing (LSA) system. The second-generation LSA100A laser annealing system offers improved operational flexibility and technical performance for advanced semiconductor production.
The LSA100A laser annealing system allows advanced front-end annealing processes and junction activation for a 65-nm or greater node. The LSA100A offers enhancements in technical capabilities for increased productivity and advanced nodes. The laser annealing system offers a low ownership cost and a uniform temperature throughout the wafer, irrespective of the device layout.
The Ultratech LSA100A systems will be deployed to meet the production expansion of 40-nm logic devices in the year 2010. The features of the company’s proprietary LSA technology was demonstrated at all the leading logic foundries.
Ultratech’s VP of Laser Product Marketing, Jeff Hebb stated that the multi-system order allows the LSA100A to be used as an annealing tool for large production at another logic foundry. The LSA system’s long-wavelength architecture allows delivering real-time temperature control, layout-independent process results, and remarkable within-die uniformity, Hebb said. He added that the LSA100A allows to further expand the 28-nm node processes.
Source: http://www.ultratech.com/