Optics and Photonics News

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NeoPhotonics Introduced New Configurations of its Multicast Switch (MCS) Modules

NeoPhotonics Corporation, a leading designer and manufacturer of photonic integrated circuit, or PIC, based modules and subsystems for bandwidth-intensive, high speed optical communications networks, today introduced new configurations of its multicast switch (MCS) modules, which are designed to be combined in a modular fashion to increase the number of degrees or directions supported by a ROADM node, reducing initial costs and providing a “pay as you grow” model to scale with network growth.

13 Mar 2014

Huawei Showcases Wavelength-Based Multidimensional All-Optical Cross-Connect Technology at OFC 2014 Conference

Huawei, a leading global information and communications technology (ICT) solutions provider, today showcased wavelength-based multidimensional all-optical cross-connect technology at the OFC 2014 Conference.

12 Mar 2014

IPG Purchases Additional GEN2000® Production Molecular Beam Epitaxy System

Veeco Instruments Inc. announced today that IPG Photonics Corporation (IPG), purchased an additional GEN2000® Production Molecular Beam Epitaxy (MBE) System to add to their fleet of Veeco MBE systems.

From Veeco 12 Mar 2014

Skorpios to Demonstrate 100G QSFP28 Transceiver at OFC

Skorpios Technologies, Inc., a fabless integrated silicon photonics system on a chip company, today announced the demonstration of a 100G QSFP28 transceiver utilizing Skorpios' Template Assisted Bonding (STAB) process.

11 Mar 2014

Molex Plans Release of 28 Gbps Silicon Photonics Active Optic Solutions

As industry demand surges for long reach, low power solutions supporting next generation 28 Gbps products and data center applications, Molex Incorporated recently announced plans to unveil a line of QuatroScale™ active optic solutions designed for 100, 200 and 400 Gbps products.

From Molex Fiber Optics 11 Mar 2014

OFC 2014: CEA-Leti to Highlight Silicon Photonics Device Library and 3D Stacking Techniques

CEA-Leti will present its silicon photonics device library and 3D stacking techniques for communication applications at OFC 2014 in San Francisco, Calif., March 11-14.

From Leti-Cea 11 Mar 2014

Novel Microscopic Structures Utilize Light in Metals to Carry Information

Using an inexpensive inkjet printer, University of Utah electrical engineers produced microscopic structures that use light in metals to carry information. This new technique, which controls electrical conductivity within such microstructures, could be used to rapidly fabricate superfast components in electronic devices, make wireless technology faster or print magnetic materials.

10 Mar 2014

Comprehensive Analysis on Global Military Electro Optical Infrared Market

ReportsnReports.com offers "The Global Military Electro Optical Infrared (EO/IR) Market 2014-2024" research report in its store that says the Asia-Pacific region is set to exhibit a CAGR of 4.37% during the period.

7 Mar 2014

MultiPhy Announce Cooperation with TeraXion to Produce 80km 100G Network Solution

MultiPhy, Ltd, a global leader in DSP-based high bandwidth CMOS communications semiconductors for Data Center and Metro Connectivity, today announced the achievement of a successful integration and interoperability demonstration of the MP1100Q MLSE Receiver/DEMUX and MP1101Q MUX Chipset with TeraXion’s CS-DCL, the smallest optical chromatic dispersion compensator from the leading manufacturer of optical components and modules for high-speed networks.

6 Mar 2014