Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has received an order from Advanced Semiconductor Engineering, Inc. (ASE) for its 300-mm, advanced-packaging lithography system. As part of ASE's expansion plans for wafer-level packaging (WLP) services, the company will employ Ultratech's lithography system at its wafer-level packaging (WLP) and redistribution process facility in Kaohsiung, Taiwan.
D.Y. Chen, vice president of Advanced Packaging Operations at ASE Kaohsiung, explains, "The use of 1X steppers is required to meet our customers' stringent economic and technology requirements. The purchase of Ultratech's 300-mm lithography system enables superior yield performance during the photolithography process, thereby allowing us to deliver the most cost-effective solution for our customers."
"This repeat order from our foundry customer reinforces the high economic value associated with the Ultratech product offering for the advanced-packaging market," noted Manish Ranjan, director, advanced packaging product marketing at Ultratech. "We truly value our relationship with ASE, and will continue to develop cost-effective solutions to meet their capacity expansion requirements."