Nov 27 2007
The new HR65D-VI series of Machine Micro Lenses (MML's) from Moritex has been designed for high-resolution discrete part inspection in semiconductor manufacturing operations including die bonding, flip chip bonding, chip on glass and chip on film machining.
The C-mounted HR65D-VI series of MML's are optimised for Mega pixel cameras up to 2/3-inch CCD chip size. Each HR65D-VI series lens includes a variable iris providing the user with the flexibility of adjusting and setting the depth of field. Incorporating integral coaxial telecentric lighting the HR65D-VI series MML's provide high resolution (3 -13 micron according to the Camera pixel pitch) and high uniformity of illumination across the entire field of view. This in combination with low distortion, high contrast and a long working distance make the HR65D-VI series a valuable addition to any manufacturer looking to implement high resolution discrete part inspection.
Moritex MML's are telecentric lenses, which maintain a constant view angle to the subject. This is achieved by keeping the optical ray paths parallel to each other. Lens telecentricity is crucial in vision and inspection applicatio ns where view angle and magnification errors need to be minimised. All Moritex MML's are packaged in compact, low mass designs, assembled to endure the rigours of even the most demanding machine vision and industrial inspection applications.
For further information or a demonstration of any of the new HR65D-VI series of MML's please contact Moritex.