EV Group (EVG) is a recognized technology and market leader for wafer processing equipment. The company targets advanced packaging, compound semiconductor/LED and silicon-based power devices, MEMS, nanotechnology and silicon-on-insulator (SOI) markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresist coating, cleaning and inspection equipment.
EVG has set worldwide industry standards for aligned wafer bonding as well as resist processing for the MEMS, nanotechnology and semiconductor industries. In fact, EVG holds the dominant share of the market for wafer bonding equipment and is a market and technology leader in lithography for advanced packaging and nanotechnology.
Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines.
A long history of innovation, superior process capabilities and advanced, cost-effective production equipment, as well as quality and support make EVG the partner of choice, both in R&D and high volume production environments. EVG's technological expertise and cooperative relationships with an extensive list of global partners enables customers to develop and successfully commercialize their innovations.
EVG is working closely with universities, as well as industry related and independent R&D institutes, and plays a major role in numerous industry consortia. Along these lines, the company founded NILCom (www.NILCom.org), a consortium of imprint lithography supply chain companies and research organizations working together to assist clients in advancing their ideas into a manufacturing environment.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company’s unique Triple i-approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.
With state-of-the-art application labs and cleanroom facilities based at its headquarters in Austria, as well as in the U.S. and Japan, EV Group (EVG) is focused on delivering superior process expertise to its growing global customer base. Last but not least, these advanced process development and application labs are designed to accommodate independent research work to explore and develop baseline processes and conduct small volume pilot line runs to simulate an actual production line process.
EV Group Scales Up Nanoimprint Lithography for Display Manufacturing
EVG620 HBL Gen II Fully Automated Mask Alignment System for HB-LEDs by EV Group
EVG560 HBL Fully Automated Wafer Bonding System for HB-LEDs by EV Group
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