Mar 23 2010
Zarlink Semiconductor (TSX:ZL) announced that it is sampling ZOE (Zarlink Optical Engine), a speed-scalable family of multi-channel optical sub-assemblies that enables manufacturers to implement lower power, more efficient interconnects for data centers and computer clusters. ZOE is being demonstrated at OFC 2010 (San Diego Convention Center, March 23-25, Zarlink booth #519).
"Data center and computer cluster operators are demanding lower power optical products for equipment interconnect that support higher data rate performance," said Bertil Kronlund, product line manager with Zarlink's Optical Products Group. "Our ZOE platform is a precise flip chip array optical sub-assembly that is ultra-compact in size and form factors delivering per-channel data rates to 14 Gbps and supporting a clear technology path to 25 Gbps per channel for up to 300 Gbps aggregate of full bidirectional data traffic. The products deliver significant signal integrity, power per bit and cost per bit advantages over any previous data center interconnect products."
The ZOE optical sub-assembly comprises a 4- or 12-channel optical light source and detector, array electronic transmitter, and receive ICs precision-mounted on a flip-chipable glass subcomponent carrier with an external array-fiber coupler in an ultra compact 7x7 mm footprint. The platform includes products that terminate 40-120 Gbps full bidirectional optical links or array unidirectional (e.g. HDMI) or serial function while supporting leading signal integrity, data density and power efficiency. For example, in 4x10 Gbps applications the ZOE platform consumes less than 0.5W while delivering the industry's highest footprint density per gigabit.
Lead customers are currently sampling the first ZOE 40G products, with full commercial release planned for first half of this calendar year. ZOE evaluation kits are available now through Zarlink's optical product group sales team.
Source: http://www.zarlink.com