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3D-Micromac at Laser World of Photonics 2019

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, presents new machine solutions for laser micromachining at Laser World of Photonics - the world’s leading trade show for the laser and photonics industry - in hall A2 at booth 129 on the New Fair Munich exhibition grounds from June 24 to 27, 2019.

microPRO - Compact laser system for all industrial micromachining applications

With the newly developed microPRO laser micromachining system, 3D-Micromac introduces a compact and cost-effective laser system for industrial manufacturing and product development. The application areas of the microPRO include ablative laser processes, such as surface structuring, drilling applications, cutting processes as well as welding processes. Depending on the application, a wide variety of processing modules and options are available. Furthermore, the microPRO can be equipped with automatic handling system for wafer, cassettes, trays, etc.

microFLEX - Roll to roll laser machining of flexible substrates

A further focus of 3D-Micromac’s trade show appearance are the already proven microFLEX roll-to-roll systems for laser machining of flexible devices. The all-in-one production solution combines high-precision laser processes with cleaning, coating, printing, and packaging technologies as well as quality control. Depending on customer requirements, an accuracy of up to ± 1 μm can be achieved. Application areas can be found in photovoltaics, medical device technology, semiconductor industry, electronics manufacturing and in the production of flexible displays.

microSHAPE - Laser system for high-precision machining of large substrates

Furthermore, 3D-Micromac presents its microSHAPE laser systems at Laser 2019.

The modular platform is designed for high accurate and high dynamic processing of large and flat substrates. Application areas are structuring and cutting of glass, surface modifications or structuring of metal substrates as well as the production of printing plates and embossing tools. The highly versatile system allows the combination of different laser processes as well as the processing with multiple laser process heads. The availability of several handling and inspection options enables the system to be a highly efficient production platform.

3D Printing Systems for Industrial Production of Micro Metal Parts

Aside from this, 3D-Micromac presents its DMP machine solutions for additive manufacturing. The DMP systems are designed for flexible series production of complex metal components using micro laser sintering. The DMP machine series is the perfect solution to achieve superior detail resolution, highest surface quality, unrivalled accuracy, and very high part density.

Lecture at Application Panel "Lasers in Micro electronics: The Future is digital"

The presentation of the 3D-Micromac at Laser 2019 will be complemented by a lecture in the Application Panel "Laser in Microelectronics: The Future is digital". Dr. Hans-Ulrich Zuehlke, Product Manager for Applications in the Semiconductor Industry, presents in his lecture "Laser Micro Machining Systems for the Industrial Production of Electronic Components" the new microPRO OCF Selective Laser Annealing System for Ohmic Contact Formation (OCF) of silicon carbide power semiconductors.

Source: http://www.3d-micromac.com

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