Xponent Photonics, the leading innovator of FTTx optical components, announced today that it will unveil its Xtreme Optics™ platform, the ultimate in minimal optical component packaging, at OFC/NFOEC 2006 in Anaheim, CA.
Xtreme Optics is the culmination of years of development focused on minimizing optical component packaging costs, and is made possible by Xponent's patented Surface Mount Photonics technology which has been Telcordia qualified in first generation modules.
"From a pricing and performance perspective, the ultimate optical package is no package," said Jeffrey Rittichier, Xponent's President and CEO. "Our Xtreme Optics are just that - powerful, high performance bi-directional optical assemblies that allow our optical chipsets to be bonded directly to a circuit board using COB (Chip-On-Board) attach processes. This represents the end of optical packages and allows our customers to achieve both tremendous cost savings and exceptional performance."
With Xtreme Optics, Xponent has succeeded in reducing the number of package piece parts and assembly time to the absolute bare minimum. Compared to TO cans, Xtreme packages can be assembled in 1/20th the touch time and require no additional external EMI/RFI shields. Xtreme is offered in two form factors, the Boardlet for easy insertion into conventional PCB assembly processes or as a single die ready for direct COB mounting for the absolute lowest cost. Xtreme is available for Xponent's entire product family of diplexers and triplexers for BPON, GPON and GEPON applications.