Revasum specializes in the design and manufacturing of capital equipment used in the semiconductor device manufacturing process. Our product portfolio includes grinding, polishing and CMP equipment used to manufacture substrates and devices for the global semiconductor industry.
The Company has leveraged its significant intellectual property portfolio to develop the new flagship 6EZ Silicon Carbide Polisher, which, alongside the 7AF-HMG Silicon Carbide Grinder, provides Revasum’s customers with an optimized, fully automated single-wafer grind and polish toolset. The solution is configurable for SiC wafers 200mm and below.
Revasum works closely with its customers to develop new systems that provide continuously improving capabilities to increase manufacturing yields and lower production costs.
The Company’s headquarters and manufacturing facility is based in San Luis Obispo, California, United States. The Company also has both direct and independent sales and service offices located in the US, China, Europe, Japan, Korea and Taiwan.
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