Toshiba Corporation today announced that it will expand its lineup of photorelays in the industry’s smallest package with the addition of four products: “TLP3417”, “TLP3420”, “TLP3440” and “TLP3475.” Mass production shipment starts from today. The new products are suited for system solutions in various applications, including semiconductor testers, measurement equipment, probe cards and medical equipment.
The new products utilize the industry's smallest package for photocouplers, the Toshiba-developed VSON4 package. Compared to equivalent Toshiba products in a USOP4 package, the new photorelays reduce the assembly area by 50% and volume by 60%, which can contribute to enhancing high density assembly.
“TLP3440” has improved leakage characteristics against high frequency at off-state, while “TLP3475” has improved high speed signal transmission characteristics at on-state. Also, for high voltage measurement requirements including SoC testing,“TLP3417” supports 80V, while “TLP3420” supports 100V. The new products have the same electrical characteristics as the conventional Toshiba USOP4 series products; “TLP3317,” “TLP3320,” “TLP3340” and “TLP3375,” making it easier to evaluate them as replacement products.
 For photocoupler products, as of September 8, 2014. Toshiba survey.
 VSON: Very Small Outline Non-leaded.
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