Nov 15 2012
Molex Incorporated will showcase its proven expertise in high-speed, high-density and high-signal integrity interconnect technology at Super Computing 2012, November 12-15 in Salt Lake City, UT. Company leaders will conduct ongoing product demonstrations in Molex booth 3745.
Products Showcased
Molex will have on display the following high-speed interconnect products and solutions:
- 25 Gbps QSFP+ Silicon Photonics Based Active Optical Cables: Molex recently demonstrated a 100 Gbps QSFP+ Active Optical Cable based on silicon photonics single chip transceiver technology enabling next generation 100 Gbps optical interconnect applications.
- Quad Small Form-factor Pluggable (QSFP+) 40 Gbps QDR and 56 Gbps Active Optical Cable (AOC) Assemblies: Providing the longest link distance and lowest power consumption on the market today, the assemblies achieve 40 and 56 Gbps data rates over long reaches of up to 4 km (2.49 miles) using only 0.78 and 1 W per cable end, respectively.
- z-Quad Small Form-factor Pluggable Plus (zQSFP+) Interconnect Solution: Designed for next-generation high-density applications found in high performance computing, telecommunications, data networking, test and measurement and medical diagnostic equipment.
- iPass+™ (HSC) CXP Copper and Optical Systems: Enables twelve channels of 10 Gbps data for up to 120 Gbps of total bandwidth; with the enhanced-footprint integrated connectors enabling ten channels of 10 Gbps data, for up to 100 Gbps of total bandwidth.
- zSFP+ Connector Solutions: Supports 25 Gbps applications, with backward compatibility for 10 Gbps Ethernet and 16 Gbps Fibre Channel applications.
Product Demonstration
Molex will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules.
Source: http://www.molex.com