Imec develops solutions for advanced, high-quality, economic vision systems, for the development of an optimal solution for the entire system such as sensor, lens, and read-out electronics. It integrates its proficiency in diverse integration of CMOS chip technology with novelties including MEMS and image sensors, design expertise and multimedia application.
The silicon photonics platform of Imec, enfolds all the complex photonic functions in a single chip, suitable for establishing photonic components with nm- scale accuracy over large writing fields, thereby improving photonic integrated circuits. The introduction of ESSenTIAL, a novel EU FP7 project facilitates industrial access to silicon photonics technology. The ePIXfab-service has been extended for an absolute technology sequence.
The industry’s high-end image sensor manufacturing platform develops specialty imagers. The base line technology is a 0.13 µm CMOS platform consisting of a pinned photodiode module that has been installed on 200 mm silicon wafers. Developments in other processes like pixel trench isolation, special (epi) substrates, backside illumination and stitching have also been achieved.
Other exhibits at SPIE Photonics West 2012 include a hyper-spectral camera solution from Imec that is based on a system-on-chip image sensor with an integrated hyper-spectral sensor. This prototype classifies various objects by employing innovative image processing methods. The resultant is equivalent to the innovative hyper-spectral references.
In association with a medical diagnostics equipment provider, the disposable silicon photonics biosensor chips Imec, have manufactured and improved a series of disposable silicon photonics biosensor chips by integrating a unique bio-compatible passivation technology with imec’s standard silicon photonic waveguide devices. Multiplexed biosensing is however facilitated through the chips. The chips were prototyped as component of imec’s CMORE service following the required modifications. Establishment of bio-compatible passivation technology on 200mm wafer scale allows the chips to be tested, thereby furnishing the customer requirements.
Source: http://www2.imec.be/