Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the availability of the OptoCooler HV series, a new class of RoHS-compliant high voltage and high heat pumping thermoelectric coolers that are optimized for standard circuitry and power requirements. The first module in the series, the OptoCooler HV14, is the latest product in Nextreme's OptoCooler(TM) family of thermoelectric coolers designed specifically for the optoelectronics and telecommunications industry.
PerkinElmer Optoelectronics, a global technology leader in digital imaging, specialty lighting and optical detection technologies, today announced it will showcase its new high-speed, high-throughput, digital x-ray detectors at the 17th World Conference on Nondestructive Testing (WCNDT) at the Shanghai Exhibition Center in Shanghai, China.
Engineers at the University of California, Berkeley, are reporting a new way of creating computer chips that could revitalize optical lithography, a patterning technique that dominates modern integrated circuits manufacturing.
TDI, an Oxford Instruments company, has recently advanced the Hydride Vapour Phase Epitaxy (HVPE) technology to the growth of InGaN. HVPE is best known for its capability to grow low defect, crack free, high quality quasi bulk GaN and AlN materials at a significantly high growth rate of up to 100 µm/hour.
Luxtera, the worldwide leader in Silicon CMOS Photonics, today announced it has signed a multi-million dollar contract with Sun Microsystems for the Defense Advanced Research Projects Agency's (DARPA) Ultraperformance Nanophotonic Intrachip Communications (UNIC) program. Luxtera's technology and silicon fabrication processes will be used to develop next-generation optical interconnects to produce chip-to-chip and intra-chip interconnect technology. This project will provide the computing industry with low–cost, enhanced high performance computer systems.
Even very small numbers of deadly infectious agents or allergenic pollen molecules can cause big problems for humans. But detecting such trace amounts is difficult to do fast enough to do any good. Current techniques -- for example, air sampling on filters or slides until enough molecules for a detectible signal or preparing specially tagged molecules for lab experiments -- are more suitable for general research than alerting people to an imminent threat.
Prior to this new advancement any testing would require mechanical surface contact, which was impossible during sample movement, to take in account substrate and machine compliance. Now with the ability to observe the precise depth of the indenter without touch, sample motion is no longer an issue and true depth of the indenter can be directly recorded.
STMicroelectronics, a world leader in the design and manufacture of automotive ICs, today announced its first high-dynamic-range CMOS camera specifically tailored for the vision-based driver-assistance segment of the automotive market. The new sensor combines the company's world-class expertise in automotive markets together with leading-edge CMOS imaging technology.
The American Physical Society has awarded a UT Dallas researcher one of the society's highest honors, recognizing Dr. Yves Chabal's development of methods to better understand processes that take place on the silicon surface that is literally the platform for the multibillion-dollar semiconductor industry.
Graphin Co., Ltd., a rapidly emerging leader for evaluation suites for image sensors, announced today that it has developed the Advanced Board, an advanced evaluation product of CMOS Image Sensors (hereinafter called CIS) supported with the MIPI (Mobile Industry Processor Interface) standard and will ship them on a commercial basis no later than the end of 2008.
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