New trends and applications from various high-tech areas will be presented again this year by the exhibitors of the Product Market "Micro, Nano + Materials" at MicroTechnology/HANNOVER MESSE from April 20 to 24, 2009 in Hanover, Germany. .
Structured Materials Industries, Inc. (SMI) announces today that it has opened its application lab facilities for the MOCVD growth of ZnO based films for transparent contact work as used with LEDs and photovoltaics, as well as ZnO films for transparent and power transistors.
Simulation of the electric field surrounding a single MWCNT in vacuum. Dr Tim Wilkinson from the Cambridge University Department of Engineering's Photonics Research Group has made an exciting breakthrough. He has combined liquid crystals with vertically grown carbon nanotubes to create a reconfigurable three-dimensional liquid crystal device structure.
Cree, Inc. (Nasdaq:CREE), a market leader in LED lighting, announces that it has entered into an exclusive patent license agreement, subject to some exceptions, with Mitsubishi Chemical Corporation (MCC). Under the agreement, MCC has been given the right to manufacture and sell freestanding GaN substrates and the right to enter into similarly-scoped sublicenses, subject to certain conditions.
Inexpensive solar cells, vastly improved medical imaging techniques and lighter and more flexible television screens are among the potential applications envisioned for organic electronics.
ON Semiconductor (Nasdaq: ONNN), a leading global supplier of high performance, energy efficient, silicon solutions, has introduced the industry's first 4-amp supercapacitor LED flash driver. The new CAT3224 addresses the emerging requirements for true high-intensity LED flash capability in high megapixel camera phones and standalone camera applications.
Leadis Technology, Inc. (NASDAQ: LDIS), an analog and mixed-signal semiconductor developer of color display drivers, Power Management and Touch Sensor ICs for mobile consumer electronic devices, today announced sample availability of the LDS8160, a new LED driver featuring its proprietary LED-Sense™ Temperature Compensation engine and its patent-pending PowerLite™ Current Regulator.
Distorted cell-phone photos and big, clunky telephoto lenses could be things of the past. University of Wisconsin-Madison Electrical and Computer Engineering Associate Professor Zhenqiang (Jack) Ma and colleagues have developed a flexible light-sensitive material that could revolutionize photography and other imaging technologies.
On January 6, 2009, NIST announced that it created nine awards under its newly formed Technology Innovation Program (TIP), for developing the next generation of structural health monitoring systems for large infrastructure elements. Distributed Sensor Technologies, Inc. (DST), of Santa Clara, Calif., has been selected as a recipient for a program entitled "Fiber Sensing System for Civil Infrastructure Health Monitoring."
Optical interconnects are foreseen as a potential solution to improve the performance of data transmission on printed wiring boards (PWB). Optical interconnects carry data signals as modulation of optical intensity, for instance through an optical waveguide, thus replacing traditional electrical interconnects.
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