Feb 9 2009
Shin-Etsu MicroSi's silicone-based resin encapsulants have shown in specific applications in the Asian marketplace that they can produce increased brightness and improve efficiency and life span of LEDs. The next generation SCR series of encapsulants are now being introduced to the global marketplace as a drop-in replacement.
These hard, Silicone-based resin encapsulants can meet strength and hardness specifications but are designed to resist cracking and absorb stress on the die much better, resulting in less cracking. The low gas permeation of SCR products greatly reduces silver corrosion, which results in a longer life span for many LEDs. Shin-Etsu MicroSi's LED packaging materials are non-yellowing, crack resistant, and optically clear even after exposure to harsh conditions.
Silicone Encapsulant Features Include:
- high refractive index allows greater light transmission,
- low gas permeability and non-corrosive to silver eliminates the effects of corrosion and,
- excellent transparency for increased brightness.
The market proven encapsulants are available for sampling and purchase by contacting Shin-Etsu MicroSi in Arizona.
In the midst of sharp revenue declines in most electronics component categories, LEDs provide a rare growth opportunity. After 10.8% growth in 2008, the LED market is expected to grow by 2.9% in 2009, aided by increased demand from LCD-TV makers, according to market research firm iSuppli Corp.
Strategies in Light
With Shin-Etsu’s long history of working with silicones, the product line has solved a multitude of manufacturing problems in microelectronic applications. These products, along with Shin-Etsu MicroSi’s line of die attach, adhesives and LED packaging materials will be on display at the Strategies in Light conference and trade show, Feb. 18-20, at the Santa Clara Convention Center in Santa Clara, California, at Booth #500.
Shin-Etsu MicroSi will also be featuring their KER series die attach materials at Strategies in Light. KER products are more compatible with silicone encapsulants than epoxy-based die attach materials, which may poison cure systems, and they have increased adhesive strength and thermal performance. Clear, opaque, and white thin bond line versions are available to minimize light absorption and maximize heat dissipation.