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Palomar Technologies Showcases Methods for Packaging LEDs at LEDs 2008 Conference

Palomar Technologies, provider of precision automation equipment and contract assembly services for microelectronics, will feature Palomar Microelectronics, its high value-added microelectronic packaging services, and its methods for packaging LEDs at the LEDs 2008 conference. The conference will be held September 29-October 1, 2008 at the Sheraton San Diego Hotel + Marina in San Diego, California.

Palomar’s pulse heat eutectic die attach and wire chain bonding equipment and services enable manufacturers of LEDs to extract the most lumens per watt possible and achieve maximum brightness in high-bright LEDs. Packaging LEDs creates challenges in assembly because of the high concentration of heat and the need for high density wire bonded connections that must be accurately placed in tight areas, have consistent loop structure, and have a connection strong enough to withstand mechanical shock and stresses due to large thermal variations. Placing LEDs in a matrix configuration results in high intensity, brighter LEDs. Stop by the Palomar Microelectronics booth, #70, and Palomar’s engineers will explain how Palomar’s wire bonding and die attach equipment performs the necessary assembly processes to achieve high brightness while handling thermal dissipation and maximum light extraction.

Palomar Microelectronics is a fast growing segment of the company created by the demand for quick-turn product development, prototyping, test, and contract assembly services. Microelectronic assembly processes include advanced wire bonding, gold ball bumping, and precision component placement for high power LEDs as well as MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.

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