Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, today announced an expansion order from a foundry in Asia to add capacity for 28-nm production.
The Ultratech LSA101 laser spike anneal system was chosen with the dual-beam option, which provides flexibility for annealing at low substrate temperatures. The LSA101 is designed for advanced applications, such as gate stack formation, silicide or post-silicide anneal. Ultratech plans to ship the LSA101 tool to the customer's foundry in Asia in the fourth quarter of 2016.
"This follow-on order reinforces the growing opportunities that we are experiencing from Asian foundries for our LSA101 systems," said Scott Zafiropoulo, General Manager of LSA and Senior Vice President of Marketing at Ultratech. "The low cost of 28-nm planar technology continues to drive the growth and capacity expansion for foundries in Asia looking to take advantage of the optimal performance-to-cost ratio at this node. While this order is to expand capacity for the 28-nm node, our long-time relationship with this valued customer began with their use of Ultratech's LSA systems at the 40- and 45-nm nodes. Today, we continue to provide Ultratech's advanced LSA technology for their 14-nm production, and we look forward to supporting their efforts at the 10-nm and below nodes."
Ultratech LSA101 Dual-Beam Laser Spike Anneal System
Built on the customizable Unity Platform™, LSA101 with the dual-beam option expands the process space by adding a second low-power laser beam that adds process flexibility and enables millisecond annealing with a low substrate temperature. Inserting a millisecond anneal step post-junction formation, such as gate stack formation, silicide or post-silicide anneal, has been shown to improve leakage and device reliability, while reducing contact resistance and improving both performance and yield. The LSA101 delivers high flexibility and extendibility for advanced annealing applications and is currently in high-volume production for advanced planar and FinFET devices.
This release includes forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can generally be identified by words such as "anticipates," "expects," "remains," "thinks," "intends," "believes," "estimates," and similar expressions and include management's current expectation of its longer term prospects for success. These forward-looking statements are based on our current expectations, estimates, assumptions and projections about our business and industry, and the markets and customers we serve, and they are subject to numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Such risks and uncertainties include the timing and possible delays, deferrals and cancellations of orders by customers; quarterly revenue fluctuations; industry and sector cyclicality, instability and unpredictability; market demand for consumer devices utilizing semiconductors produced by our clients; our ability to manage costs; new product introductions, market acceptance of new products and enhanced versions of our existing products; reliability and technical acceptance of our products; our lengthy sales cycles, and the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; competition and consolidation in the markets we serve; improvements, including in cost and technical features, of competitors' products; rapid technological change; pricing pressures and product discounts; our ability to collect receivables; customer and product concentration and lack of product revenue diversification; inventory obsolescence; general economic, financial market and political conditions and other factors outside of our control; domestic and international tax policies; cybersecurity threats in the United States and globally that could impact our industry, customers, and technologies; and other factors described in our SEC reports including our Annual Report on Form 10-K filed for the year ended December 31, 2015 and our Quarterly Report on Form 10-Q filed for the quarterly period ended April 2, 2016. Due to these and other factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.