Jun 22 2010
Manufacturer of advanced optical transport products, Ekinops, and Marubeni Information Systems (MSYS), supplier of next generation information technologies, have signed a business deal to distribute advanced optical transport equipment in the Japanese telecom sector. Under the agreement, MSYS will distribute, support and maintain Ekinops’ optical transport equipment in the Japanese market.
The long haul DWDM platform and the Ekinops 360 platform will be introduced shortly in the Japanese market. The Ekinops 360 platform contains the Transport on a Chip (T-Chip) technology, which will help address the dynamic needs of the Japanese telecom service providers. The Ekinops 360 platform offers a cost-effective solution and delivers superior performance with exceptional quality and stability.
The Ekinops 360 offers CWDM and DWDM transport solutions to address long haul, regional and metro applications. The Ekinops 360 platform also provides a number of features such as the DynaMux, DynaFEC and WaveBonding technologies. The DynaMux can enable users to multiplex any type of protocol on a single wavelength. The DynaFEC removes the errors faced in transmission, while the WaveBonding is an affordable 40G technology. All these functions are implemented by the T-Chip technology, which brings the entire electronics of the transport system into a single chip. This ensures that customized products can be manufactured in a short period of time with minimum power consumption.
Ekinops’ Vice President of Sales, Marc Olivier, stated that the agreement provides a significant advantage to both the companies, and the Ekinops 360 will reinforce MSYS’ reputation as the market leader in the WDM industry.
Source: http://www.ekinops.net