Phononic, the company revolutionizing cooling and heating with solid-state technology, today announced its pico-TEC series, a high-performance solid-state thermoelectric module (TEM) designed to provide precise temperature control in order to meet the unique thermal management requirements of optoelectronics and fiber optic modules.
The company’s pico-TECs are manufactured using advanced automated semiconductor fabrication technology and provide superior performance and reliability with ultra-thin form factor flexibility.
“This new generation of ultra-thin semiconductor technology removes barriers to miniaturization and enables higher data rates and operating speeds in a whole range of electronic applications,” said Michael J. Bruno, vice president and general manager of Phononic’s electronics cooling business unit. “Optoelectronics and fiber optic communication devices, such as Fiber To The X (FTTX), CATV and optical LAN requiring active cooling in an extreme form factor can immediately benefit from our pico-TECs.”
Smaller in height than standard micro-TECs, but still delivering high performance, Phononic’s pico-TECs have a device height of less than 0.7mm with a typical ΔT max of 65°K and a Qc max of 25 W/cm2 or more. In addition to the ultra-thin and ultra-small footprint, the pico-TECs offer accurate temperature control, reduce power consumption and application specific design options.
Additional features include:
- Metalized and bare ceramic headers
- Wire bondable interconnects
- Application and customer-specific device designs
- RoHS compliant components
The new, ultra-thin pico-TEC series complements Phononic’s current product series of mini- and micro-TECs, scalable bulk devices, as well as ruggedized heat pumps as the company’s smallest TEC to date. This proprietary technology is manufactured in Phononic’s ISO 9001:2008 certified facility in Research Triangle Park, NC.