Aug 11 2010
The High Density Packaging User Group International (HDP User Group), a non-profit cooperative electronics R&D organization, announced the commencement of a new optical electronics-based project. The project is currently in the definition stage, and all the interested non-member and member companies are welcomed to the join the project.
The HDP User Group has previously added subgroups to the optical electronics project in areas, namely, waveguides, devices, standards recommendations, and architecture. The group anticipates that new areas of interests will be identified and will include additional subgroups accordingly. The HDP User Group is also ready to accept participation and contribution from any organization, which is interested in optoelectronics field.
The Optical Interconnect project plans to ease the intra-cabinet interconnect bottlenecks noticed in Terabit-scale systems, by connecting the optical paths to electronic devices. The opto project is currently designing optical interconnect architectures that have the capability of meeting the energy efficiency and capacity requirements of high-speed switches, routers, servers, and computers.
The project also focuses on the challenges that hinder using optical technology for intra-and inter- card links. Such challenges include optical simulation and design practices, strong optical connections, and the absence of reliability data and system-level performance.
Source: http://www.hdpug.org/