Apr 29 2009
Palomar Technologies, a world leader in providing solutions for microelectronic and optoelectronic packaging, and experts in precision wire bonding, gold wire bonding, and high accuracy component placement systems, announced today that it will exhibit at SMT Nuremberg from May 5 through 7.
Palomar's Model 8000 Wire Bonder / Ball Bonder is uniquely suited to yield high reliability low profile interconnects. Using its patented ball bump process, ball bumps can be precisely placed on LED die pads. Typically, the next step is to complete a reverse bond where the stitch bond is attached to the bump. This process is commonly referred to as a Stand-off Stitch and enables greater light output from each LED. Using this process, Palomar Technologies has been able to reliably hold loop heights below 100µm with wire sizes up to 38µm diameter. In addition to low profile loops, a key benefit is increased joint strength as evidenced by virtually 100% mid-wire breaks during destructive pull test.
Palomar Microelectronics, the development, test, and contract assembly division of Palomar Technologies has seen rapid growth in the last 18 months in applications requiring high process expertise. Palomar Microelectronics assembly services include advanced wire bonding, gold stud bumping, eutectic die attach, active optical cable packaging, power amplifier assembly, solar cell assembly, wafer scale packaging, precision component placement for high-power LEDs, MEMS, microwave/RF, multichip modules (MCMs), hybrid microcircuits and device bonding for GGI processes.
Recently, Palomar formed alliances with 3 system manufacturers to offer customers worldwide the most complete first-level interconnect solutions available. The alliance companies' systems include Precision Fluid Dispensers, Bond Testing and Die Sorters, and Manual Wire Bonding and Die Bonders to complement Palomar's automatic assembly systems.