Polymicro Technologies, a subsidiary of Molex Incorporated, will exhibit FBPI optical fiber and hollow silica fiber products at the Conference on Lasers and Electro-Optics (CLEO), sponsored by the American Physical Society/Division of Laser Science, IEEE Photonics Society and the Optical Society.
Being held June 9-14 at the San Jose Convention Center in California, the CLEO 2013 technical show provides an annual forum for scientists involved in chromatographic separations.
“Many spectroscopic applications require high performance optical fibers that transmit light over a broad spectrum,” states Robert Dauphinais, business development manager, Polymicro Technologies. “Unlike standard optical fibers which are limited by transmission spectral range, Polymicro’s proprietary optical fiber transmits a wider range of wavelengths with relative uniformity across the wavelength range.”
The Polymicro Technologies exhibition (booth 2328) at CLEO 2013 will showcase:
- FBPI Fiber
Optimized for NIR attenuation and UV solarization resistance to improve transmission over a wider spectral range, Polymicro silica-based FBPI optical fiber delivers industry-first panoramic spectroscopy and sensor analysis. Available in a range of core diameters from 50-600 μm, broad spectrum FBPI optical fiber with a low -OH pure silica core demonstrates significantly reduced content of UV defects and other UV absorption centers. In the near-infrared (NIR) wavelength region to beyond 2100 nm, Polymicro FBPI fiber attenuation is equivalent to standard NIR fibers having a low -OH silica core and F-doped cladding. Comparable to solarization properties of standard UV optimized high -OH fibers with high radiation resistance, FBPI fiber features UV transmission down to 200 nm.
- Hollow Silica Wavelength (HSW) Fiber
Strong and flexible Polymicro HSW fiber for CO2 laser delivery can be optimized for wavelengths in IR region 3-20 μm for a range of applications, including replacement for high cost, heavy, rigid articulated arms in medical and dental laser applications, industrial cutting, and laser printing and marking. Enabling high laser power delivery ≤100W, the hollow construction silica simplifies end termination, reduce abrasion and provide a robust buffer in harsh environments. The geometry of the biocompatible fiber can be easily changed to accommodate part customization. Available with custom buffers, HSW features removable, reusable Poly-Lok™ connectors ideal for prototyping. Visit the Polymicro website for the HSW User’s Guide.
Molex and Polymicro facilities are ISO 9001, 13485 and 14001 certified. For more information about Polymicro solutions please visit www.molex.com/polymicro. To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at www.molex.com/link/register.
Source: http://www.molex.com/