Ultratech recently declared the shipment of its 50th laser spike anneal (LSA) system. Of all the 50 systems, Ultratech has shipped over 15 of its flagship LSA101 systems that are capable of reaching throughputs of up to 60wph.
The unique long-wavelength LSA technology of Ultratech provides lower leakage for the existing high-end smartphones and media tablets, without compromising on the performance. It is the novel process tool of record that supports production of leading-edge devices within foundries.
According to the Chairman and Chief Executive Officer, Arthur W. Zafiropoulo, the company’s shipment of 50th LSA system to a major Asian foundry signifies its advancement and commitment to provide its global clients with unique products and services. LSA is of much use in leading IDMs and foundries worldwide. Currently, it has been implemented as the ideal technology for high-volume production of advanced logic devices ranging from the 45- to 28-nm nodes.
The LSA101 helps achieving critical millisecond annealing applications for the 28-nm node and less, than equivalent millisecond annealing technologies. It also ensures real-time closed-loop temperature control over the entire wafer, high layout-independent process results, and maximum within-die uniformity. The system includes minimum dwell time of 200 µs, reducing overlay errors for devices having aggressive strain engineering. The superior process control, integrated to reduced dwell time capability, enables the customers to maintain high processing temperatures, in addition to ensuring more yield, enhanced device performance, and lower leakage. LSA101 provides a maximum throughput of 60wph , representing Ultratech's objective to create advanced technology systems with multiple-features.