Why ContourX-1000 is the Benchmark in Automated 3D Optical Metrology

Bruker’s ContourX-1000 white light interferometry (WLI) system features advanced hardware and software for fully automated 3D surface texture and roughness measurements.

The one-click Advanced Find Surface™ tool (featuring auto-focus and auto-illumination) eliminates the need for manual surface registration, improving both usability and measurement speed.

With its self-adapting USI measurement mode and streamlined VisionXpress™ interface, ContourX-1000 ensures reliable, high-precision measurements on any surface, by any user, even in fast-paced, multi-user production environments.

Only the ContourX-1000:

  • Fast, flexible production-floor metrology with tip/tilt head, dual light sources, and advanced automation
  • High accuracy and reliability through self-calibrating laser and built-in vibration isolation
  • User-friendly measurement and analysis with guided workflows and recipe-driven software

High-aspect-ratio MEMS structure.

High-aspect-ratio MEMS structure. Image Credit: Bruker Nano Surfaces and Metrology

High-density bump interconnect.

High-density bump interconnect. Image Credit: Bruker Nano Surfaces and Metrology

Stitched measurement of a bifocal contact lens showing form.

Stitched measurement of a bifocal contact lens showing form. Image Credit: Bruker Nano Surfaces and Metrology

Technical polymer film.

Technical polymer film. Image Credit: Bruker Nano Surfaces and Metrology

Embodying the Power and Versatility of Non-Contact Surface Metrology

Culmination of Latest Optical Profiling Hardware Advances

The ContourX-1000 integrates Bruker’s patented tip/tilt head, dual-LED light source, automated turret and stages, and a range of wafer chuck options. These features support fast configuration and optimization for various production and R&D applications, including challenging surfaces and deep features.

Benchmark for Accuracy and Robustness

Background: IC chip topography with overlay of automated optical inspection (AOI) image Foreground: 1 μm periodic polymer grating.

Background: IC chip topography with overlay of automated optical inspection (AOI) image Foreground: 1 μm periodic polymer grating. Image Credit: Bruker Nano Surfaces and Metrology

In addition to Bruker’s exclusive interferometry capabilities, the ContourX-1000 includes an internal laser reference and integrated vibration isolation. This combination ensures system stability, consistent tool-to-tool performance, and gage-capable metrology—even in environments with significant external noise.

Paragon of Powerful Automated Measurement and Analysis

Automation graphical user interface (GUI) with wafer map.

Automation graphical user interface (GUI) with wafer map. Image Credit: Bruker Nano Surfaces and Metrology

The Universal Scanning Interferometry (USI) mode automatically adjusts measurement settings to maintain nanometer-level resolution across height ranges of several microns. The VisionXpress interface is designed to separate measurement quality from operator experience, enabling consistent results.

Advanced Find Surface activates auto-focus and illumination adjustments to help users in multi-user environments obtain reliable measurements.

The ContourX-1000 supports software packages including SureVision, Multi-Region Analysis, Vision64 Map™, and Film Measurement to meet specific application needs.

ContourX-1000 Specifications

Source: Bruker Nano Surfaces and Metrology

. .
Measurement Modes PSI, USI, VSI, Optional Film
Max. Scan Range ≤10 mm
Vertical Resolution1 <0.01 nm
Lateral Resolution 0.38 μm minimum (Sparrow criterion);
0.13 μm (with AcuityXR®)
Step Height Accuracy2 <0.75 %
Step Height Repeatability <0.125 % 1 sigma repeatability
Max. Scan ≤122 μm/sec (with laser reference)
Sample Reflectivity 0.05 % to 100 %
Max. Sample Slope ≤40 ° (shiny surfaces);
≤87 ° (rough surfaces)
Sample Height ≤100 mm
Sample Weight ≤45 kg
XY Sample Stage 300 mm automated (0.5 μm encoders); Integrated vibration isolation table
Z Focusing 100 mm automated
Tip/Tilt Function ±5 ° automated in head
Optical Metrology Module Patented dual-LED illumination
Objectives Parfocal: 2.5X, 5X, 10X, 20X, 50X, 100X, 115X; LWD: 1X, 2X, 5X, 10X;
TTM: 2X, 5X, 10X, 20X; Bright Field: 2.5X, 5X, 10X, 50X
Single-objective adapter; Optional motorized five-position turret
Available Zoom Lenses 0.55X, 0.75X, 1X 1.5X, 2X auto-sensing modules
Camera 5 MP monochrome with 1200 x 1000 data array; Optional color camera
Software System Vision64® and VisionXpress on Windows 10 LTS 64-bit OS
Software Packages AcuityXR; Advanced PSI; Automatic Pattern Alignment; MATLAB; Multiple Region Analysis;
Optical Microlens Analysis; Production Mode; SDK; TCP/IP; SureVision; Vision64 Map
Reporting Languages English; German; French; Italian; Spanish; Japanese; Chinese; Polish; Korean; Brazilian Portuguese; Russian
Automation Auto-focus; Auto-intensity; Auto-saving; Auto-stitching;
On-fly analysis; Scattered and grid automation; Recording in database
Calibration Via NIST/PTB traceable step height and lateral ruler standards;
Optional auto and continuous internal laser signal
System Footprint 852 mm x 793 mm x 1608 mm (W x D x H)
Weight 493 kg
Warranty 12 months
Certification CE-Certification; ANSI B46.1 compliant

1 As demonstrated by taking the one sigma Sq value of 30 PSI repeatability measurements on an SiC reference mirror.
2 Absolute accuracy for step heights 8 μm and higher. 

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