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IMRA, DISCO to Develop Laser Dicing Systems

IMRA America, a part of Aisin Seiki, has decided to enter into partnership with DISCO Corporation to develop advanced lasers and processing systems that will be used for laser dicing of semiconductor materials.

IMRA America has delivered substantial number of femtosecond fiber lasers to semiconductor production plants. These lasers are capable of offering increased reliability and stability essential for consistent operation and therefore have wide applications in semiconductor manufacturing facilities. Furthermore, IMRA America has licensed the US Patent 5,656,186 from the University of Michigan, which is mandatory for processing femtosecond and picosecond laser materials.

Both companies anticipate offering new, innovative solutions by leveraging the characteristic capabilities of femtosecond lasers that help reduce thermal effects in materials processing. These lasers can emanate light pulses at a high repetition frequency with a sequential rate of femtoseconds. The femtosecond pulses represent a short pulse duration that can reduce thermal damage. Femtosecond laser pulses are capable of creating alterations inside transparent materials without impacting the surface.

Established in 1990, IMRA America has been successfully progressing with the development, manufacturing, marketing, sales and services of femtosecond fiber lasers.

The DISCO Corporation was founded in 1940. This ancient company focuses on manufacture, maintenance and sale of precision machines used for cutting, grinding and polishing. It offers training and maintenance procedures for operators using precision cutting, grinding and polishing machines. It also demonstrates how to disassemble and recycle those precision machines and enables its leasing. It manufactures precision diamond abrasive tools and sells used machines.

Source: http://www.imra.com/

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