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Teledyne DALSA Expands its Xtium2 Frame Grabber Series with Three New CoaXPress Models

Teledyne DALSA, a Teledyne Technologies company and global leader in machine vision technology, announces its Xtium™2-CXP series of high-performance frame grabbers. The new series transfers image data to the host memory at maximum acquisition rates with zero CPU utilization, allowing host applications to operate at maximum efficiency.

Xtium2-CXP frame grabber series facilitate maximum efficiency. Image Credit: Teledyne DALSA

The Xtium2-CXP series is compatible with CoaxPress® version 2.0 and uses the PCI Express Gen3 x8 platform to deliver sustained image acquisition bandwidth of up to 6.8 GB/s to the host memory. The Xtium2-CXP frame grabber series supports image acquisition rates of up to 12.5 Gbs and models are available in 4, 2 and 1-channel configurations. The Xtium2 series is fully supported by Teledyne DALSA’s free Sapera LT SDK.

With its 2 GB of image memory, the Xtium2-CXP prevents data loss when the PCIe bus is being utilized by other devices in the system, and data cannot be transferred for processing. Fully compatible with Teledyne DALSA’s Trigger-To-Image Reliability (T2IR) framework, the new CXP boards deliver ready-to-use images and support both area and line scan monochrome, RGB and Bayer color cameras.

“The Xtium2-CXP series combines high performance image acquisition with our T2IR framework making it an ideal choice for demanding applications in a growing number of industries,” said Senior Product Manager, Inder Kohli.

When combined with the industry’s newest and highest resolution cameras, the Xtium2-CXP series frame grabbers enable some of the most demanding vision applications.  

Xtium2-CXP Key Features:

  • Half-length PCIe Gen3 x8 board, with 4 micro-BNC coaxial connectors
  • Maximum image acquisition bandwidth of up to  5.0 GB/s, maximum host bandwidth up to 6.8 GB/s
  • Supports CXP 1.x and 2.0 cameras with 4, 2 or 1 output channels of up to 12.5 Gbs/ channel
  • Simultaneous acquisition from multiple independent cameras

To learn more about the new Xtium2-CXP series please drop by our booth #D-01 at the International Technical Exhibition of Image Technology and Equipment 2019, December 4-6, in Yokohama, Japan.

Source: http://www.teledynedalsa.com/en/home/

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