Agilent Technologies Inc. today introduced the Agilent Medalist SJ50 Series 3 Automated Optical Inspection system (AOI), whose unique imaging chain and powerful inspection algorithms qualify it as the industry's best AOI.
The new SJ50 Series 3 expands on the existing SJ50 product line, providing industry-leading optical performance. It improves ease of use, throughput, component location and supportability, as well as enabling manufacturers to cope with emerging technologies, such as 01005 components. These enhancements will allow manufacturers to keep up with ever-increasing line rates with better capability and resolution.
"The Agilent Medalist SJ50 Series 3 is a cost-effective, fast, easy-to-use and highly reliable imaging platform that provides full coverage that can be flexibly deployed," said Bernadette Duffy, Agilent's marketing manager for AOI. "Unlike other AOI solutions that compromise quality for cost, our solution consistently provides profitable growth for manufacturers through our best-in-class technology, backed by our global service and support team who are committed to meet the needs of customers' production lines, no matter when or where."
In addition to helping manufacturers achieve a better bottom line through faster time-to-market and cost efficiency, the SJ50 Series 3 offers further enhancements to help manufacturers address emerging technical challenges. For instance, low-contrast components have presented inspection issues industrywide. The algorithms included in the SJ50 Series 3 system are designed to bring greater image clarity to low-contrast components, providing the end-user with better defect analysis capabilities. The image clarity results in lower false-call rates and improved defect detection.
The Agilent Medalist SJ50 family is one of the most flexible AOI systems available on the market. It is ergonomically advanced with significant user and system interfaces. A key differentiator of Agilent's AOI offering is the unparalleled flexibility inherent in the technology. It can be deployed in a 2D paste, pre-reflow, mixed-mode and post-reflow environment while quickly converting the optics head for inline 3D solder paste inspection. This flexibility offers manufacturers a system that can be easily deployed in a multitude of line positions for those sites that are new to AOI or those that are growing and have ever-changing needs.
Both the Medalist SJ50 and SP50 Solder Paste Inspection systems integrate key enabling technologies for a degree of accuracy and flexibility not previously seen in AOI. Interchangeable lighting heads and Agilent's unprecedented unified platform technology allow the systems to be redeployed at paste, pre- or post-solder as needs change. New techniques such as Solid Shape Modeling deliver the highest-resolution 3D images ever achieved in AOI. Seamless links to downstream repair stations and statistical process control tools allow better control over collected data, so your investment can improve line yields and improve processes and board quality.
Further Information and Availability
The new Agilent Medalist SJ50 Series 3 system will begin shipping in October 2006 and can be seen in Booth 5821 at the Assembly Tech Expo 2006, Sept. 26 - 28, at the Donald E. Stephens Convention Center, Chicago, Ill.
More information is available at www.agilent.com/see/aoi .