Laser system developer, Altechna has developed a Sollas workstation for an industrial-research manufacturing line. The workstation will execute four technological operations on laser selective melting, laser selective ablation and laser scribing processes.
The Sollas will carry out operations based on laser marking; edge isolation; back contact laser firing; and removal of SiNx SiO2 for emitter contact formation. The workstation focuses on two laser working areas using process vision system, high-speed wafer recognition and positioning device, and high-speed beam scanners.
The wafer handling system includes an active pneumatic anti-vibration system; four separate locations for cassettes with 25 slots for 6 or 5’’ wafers; two load/unload manipulators with vacuum forks; and a rotary table with eight seats for wafers. The workstation uses two laser sources, namely, a 1030 nm laser featuring a TH generator for SiNx ablation purposes, and a 1064 nm fiber laser for firing and scribing processes. The Sollas workstation has a 2.5 × 3 × 2 m enclosure and consumes power of 4 kW. In addition, the Sollas comes with software that has research and industrial modes.