Remtec announced that it has installed a new sophisticated gold-tin plating line and related quality assurance devices and process controls to cost-efficiently develop laser diode submounts.
The high-quality laser diode submounts can be produced with Zero Pullback copper metallization and ceramic substrate packages. The products will benefit from the extra advantages of Plated Copper & Thick Film (PCTF) technology such as wraparounds.
Remtec has developed a new quality control device that incorporates a spectrophotometer, energy dispersive x-ray fluorescence (EDXRF) and an x-ray fluorescence (XRF) device. These devices enable precise and rapid control and recording of vital parameters such as thickness distribution and gold-tin composition.
The novel plating line generates gold-tin alloys with compositions ranging between 80/20 and 72/28. The thickness can also be indicated between 3 and 50 microns. The substrates come with selective plating choices and numerous metallization techniques and permit both TiW thin film seed layers and silver thick films of varying thicknesses.
Remtec, with an in-house control of all gold-tin plating line processes, offers a reliable source for low-cost manufacturing of semiconductor components, packages, ceramic substrates and laser diode submounts.
Source: http://www.remtec.net/