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Results 281 - 290 of 307 for Indium
  • News - 23 Feb 2008
    The energy from sunlight falling on only 9 percent of California's Mojave Desert could power all of the United States' electricity needs if the energy could be efficiently harvested, according...
  • News - 18 Feb 2008
    Oki Electric Industry Co., Ltd. today announced it has developed a 10Gbps differential outputs type driver IC (KGL4186KD) for Mach-Zehnder (MZ) modulator for optical communication. The KGL4186KD...
  • News - 16 Feb 2008
    The U.S. Department of Energy (DOE) today announced that DOE will provide up to $20.6 million for a total of 13 projects aimed at advancing solid-state lighting (SSL) research and product development....
  • News - 12 Feb 2008
    OSRAM has granted a license, in return for an appropriate fee, to PerkinElmer Inc., the American supplier of precision and photonic components, that allows it to manufacture and market white LEDs with...
  • News - 29 Jan 2008
    Global Solar Energy (GSE), the premier manufacturer of Copper Indium Gallium diSelenide (CIGS) thin-film solar products, today announced it is the first in the CIGS thin-film market to achieve an...
  • News - 18 Jan 2008
    The tiny copper wires that connect different areas of an integrated circuit may soon limit microchip-processing speeds. So European researchers have developed technologies to produce and combine...
  • News - 10 Jan 2008
    Saint-Gobain and Novaled have demonstrated the feasibility of large area OLEDS, based on a new high-performance metallic anode, with Saint-Gobain Recherche technology and Novaled OLED proprietary...
  • News - 3 Jan 2008
    The Defense Advanced Projects Agency (DARPA) has selected Goodrich Corporation to develop next-generation night vision sensor technology for helmet-mounted and micro vehicle applications. A three-year...
  • News - 21 Dec 2007
    The ultra-high data speeds possible on optical fibre networks will only come into their own when the fibres reach the last mile into everyone’s home. But that will require miniaturisation and...
  • News - 20 Dec 2007
    Complex three-dimensional (3D) integrated circuits involving both optical and electronic elements are now easier to make, thanks to a “wafer bonding” technique developed by a European...

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