Posted in | Device Assembly

Automated Photonic Device Assembly with Modular System Approach

AssemblyLine systems, which are high-precision, alignment and assembly machine solutions, are developed for automated manufacture (align-and-attach) of photonic devices.

They exclusively integrate flexible attachment configurations and fast-active alignment with a tried and tested software control interface, encompassed in an industry-standard design. Optional modules offer additional features, and the high-end models offer wafer processing capability, optical test modules, and automatic tool changing.

New, next-generation in-line assembly systems from ficonTEC incorporate a redesigned platform (400, 800, 1200, 1600). They come in particular in-line configurations as an all-around and individual production cell for existing production lines. Alternatively, it is also possible to supply them as task-optimized production segments that consist of various distinctly configured systems. In principal, it is possible to visualize even entire production lines.

ficonTEC - Next-generation In-line Photonics Assembly & Test Systems

Software Control

ProcessControlMaster (PCM) from ficonTEC is a process-oriented, user-friendly application software and control interface that is available with all multi-machine configurations and turnkey systems. PCM incorporates an insightful UI with all high-resolution positioning, machine vision, and system management routines needed for reliable and repeatable driving of passive/active alignment and attachment/bonding process hardware. It is also already completely enabled for automated electro-optical test and characterization tasks. It can also operate and monitor single lines, and even sync parallel lines remotely.

Key Features

  • Fully-automated photonic device assembly
  • Configurable closed-loop fast-active alignment
  • High-precision AUTOALIGN multi-axis motion
  • Multiple chip and wafer handling options
  • Epoxy dispensing, curing, and shrinkage control

General Tasks and Applications

  • Pick-and-place
  • Thermal or UV curing
  • Precision adhesive dispensing
  • Chip-to-package assembly
  • Active mirror align-and-attach
  • Fiber/FAC/SAC align-and-attach
  • HPLD module assembly
  • Active VBG spectral tuning
  • Hybrid integrated photonics
  • PICs, silicon photonics

Modular, Flexible and (Re-)Configurable

  • FAB and HVM-ready — parallelizable and scalable
  • Sophisticated feed IN/OUT options
  • Daisy-chain multiple systems for production segments
  • Single systems slot into existing production lines
  • Add and/or swap modules for reconfiguration and repurposing
  • Operate, monitor, and sync parallel lines remotely


  A400 A800 A1200 A1600
Motion System 4-axis alignment Gantry system with min. 6-axis high-precision alignment* Gantry system with min. 6-axis high-precision alignment*
Cantilever system w/o multi-axis system
Cantilever system with min. 6-axis high-precision alignment*
Working Area (max)
(w x b x h, mm)
100 x 200 x 200 100 x 300 x 50** 200 x 300 x 50** 200 x 100 x 50**
Handling Options Single conveyor Single or dual conveyor
Wafer Capable No Up to 6” Up to 12”
Machine Vision Standard/dual positioning and observation camera options
Feed Options Suitable for Jedec or Auer boats, or for customer trays
Software Features Ergonomic, flexible and powerful process software – extended operator-less control – remote control server option
Physical Features Rugged steel-base production cell - access door lifts vertically without affecting footprint
Minimum connections 400 VAC (or country specific), air/vacuum, 100 Mbit/s network
Cleanroom compliance ISO 6***
(w x b x h, mm)
400 x 1200 x 1600/2000 800 x 1200 x 1600/2000 1200 x 1200 x 1600/2000 1600 x 1200 x 1600/2000
Weight (typ., kg) 600 1300 1800 2500


*alternative multi-axis configurations optional

**working area with 6-axis system

***others available on request

Automated Photonic Device Assembly with Modular System Approach

Assembly line systems - Picture 1
Assembly line systems - Picture 2
Assembly line systems - Picture 3
High-precision alignment unit
Fiber/FAC/SAC attach
Adhesive dispensing
Silicon Photonics
Die sorting
Fiber alignment
Thermal or UV curing

Other Equipment