Optics & Photonics News

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Cree to Demonstrate XLamp XP-G LED at LIGHTFAIR International

Cree, Inc. (Nasdaq:CREE), a market leader in LED lighting, announces it is demonstrating the newest addition to its lighting-class XLamp(r) LED family -- the XLamp XP-G LED -- at LIGHTFAIR International in New York, May 5-7, 2009.

30 Apr 2009

Novel Continuously Running Camera that Captures Images Roughly 1000x Faster than Any Existing Conventional Camera

Ultrafast, light-sensitive video cameras are needed for observing high-speed events such as shockwaves, communication between living cells, neural activity, laser surgery and elements of blood analysis. To catch such elusive moments, a camera must be able to capture millions or billions of images continuously with a very high frame rate. Conventional cameras are simply not up to the task.

30 Apr 2009

Carl Zeiss Microscope Workshop Attracted Over 150 Scientists

More than 150 scientists and users of the ZEISS CrossBeam® and Helium Ion Microscope systems met at the 1st European user workshop in Dresden. In several sessions the participants got an overview on current product developments and new applications.

30 Apr 2009

Integrating Plasmon-Based Nanophotonic Circuitry with ICs

IMEC, Europe's leading independent nanoelectronics research institute, reports a method to integrate high-speed CMOS electronics and nanophotonic circuitry based on plasmonic effects. Metal-based nanophotonics (plasmonics) can squeeze light into nanoscale structures that are much smaller than conventional optic components.

30 Apr 2009

Master Bond's New Optical Adhesive Specially Formulated for Optimal Optical Bonding

Master Bond's new MS151 optical adhesive has been specially formulated for optimal optical bonding. It is a two-part silicone adhesive with silicone's inherent temperature resistance and flexibility, a refractive index of 1.43 and superb optical clarity.

30 Apr 2009

New Optical Profiler Optimized for Non-Destructive Measurement of Surfaces

FRT presents a new profilometer at this year's CONTROL 2009 in Stuttgart. The optical profiler has been optimized for the non-destructive measurement of surfaces. The MicroSpy Profile measures roughness, contour, 3D topography, step height, planarity, geometry, volume, bearing contact area and more with metrological precision.

30 Apr 2009

Compact Lasers Suitable for Mass Production are Now Within Reach

Compact lasers which can work in formerly inaccessible parts of the spectrum and are suitable for mass production are now within reach, thanks to pioneering work by a European consortium.

29 Apr 2009

Palomar Microelectronics Specialists Will Be on Hand to Explain Wire Bonding for LED Packaging

Palomar Technologies, a world leader in providing solutions for microelectronic and optoelectronic packaging, and experts in precision wire bonding, gold wire bonding, and high accuracy component placement systems, announced today that it will exhibit at SMT Nuremberg from May 5 through 7.

29 Apr 2009

Intematix Announces the Release of a New Series of High-Efficiency Power LEDs

Intematix Corp., a leading innovator in phosphors, LED components and solid state lighting modules today announced the release of a new series of high-efficiency power LEDs.

29 Apr 2009

Energy Efficient PHOLED Technology Offers Manufacturers a ‘Green’ Technology to Incorporate into Display and Lighting Products

Universal Display Corporation (NASDAQ:PANL), an innovator behind today's and tomorrow's displays and lighting through its UniversalPHOLED™ phosphorescent OLED technology, today is exhibiting the environmental, energy efficient and "green" benefits of its OLED technology at Pepcom's EcoFocus/New York, to be held from 6:00 to 9:00 PM ET at the Metropolitan Pavilion in New York City.

29 Apr 2009

B/E Aerospace to Supply Cabin Lighting for Next Generation Boeing 737 Program

B/E Aerospace, Inc. (Nasdaq:BEAV), the world's leading manufacturer of aircraft cabin interior products and the world's leading distributor of aerospace fasteners and consumables, today announced that The Boeing Company has selected B/E Aerospace as its manufacturer of cabin lighting for the next generation Boeing 737 aircraft program.

29 Apr 2009

Significant Order Win for EVG Expands Company's Presence in LED Market

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order from AmberWave Systems for its EVG520IS wafer bonding system and its EVG810LT low-temperature plasma activation system.

29 Apr 2009