LED Fabrication

Tools designed for manufacturing LEDs and HB-LEDs, including wafer bonding systems and mask alignment systems
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Equipment
The EVG620 HBL is a dedicated, fully automated mask alignment system for high volume manufacturing of High-Brightness LEDs (HB-LEDs), compound semiconductors and power electronics.
The EVG560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing. The flexible tool supports metal, adhesive and fusion bonds of various substrate types.
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