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CyberOptics to Display QX100 and Value-Add Initiatives at NEPCON China 2012

Published on March 20, 2012 at 6:14 AM

By Andy Choi

CyberOptics will introduce its QX100, an AOI tabletop system integrated with AI2 next-generation image analysis software. The system will be showcased in addition to a sneak preview of CyberOptics’ latest AOI and SPI systems during the forthcoming NEPCON China exhibition.

CyberOptics to Exhibit Its Newest Range of AOI and SPI Systems along with Unique Value-Add Programs at NEPCON China 2012

The show will be held from April 25 to 27, 2012 at the Shanghai World Expo Exhibition and Convention Center.

The event will also feature CyberOptics’ supplementary programs such as AOI-SPI correlation analysis, one-step SPI/AOI programming, and printer closed loop feedback capability.

The QX100 revolutionizes tabletop inspection by integrating the versatility of a tabletop system with the performance of an in-line inspection system. The system is made up of the Strobed Inspection Module (SIM), and utilizes CyberOptics’ unique image acquisition technology.

Autonomous Image Interpretation (AI2) powers the classy QX100, wherein its technology enables rapid programming. A single workflow arrangement of QX100 makes it suitable for high-mix environments. Programs created on QX100 demonstrate 100% compatibility with in-line systems.

CyberOptics will display its SE500ULTRA, the latest 3-D SPI system at the SPI forefront. Designed with an all-new, ultra-fast sensor, this novel system sets a new standard for SPI inspection speed. The sensor is integrated with the company’s unique ‘all-in-one’ scan algorithm that makes the 3-D SPI system to be 30% faster than the earlier models. In addition, a Dual Illumination sensor option in the system enhances repeatability and reproducibility on tiny paste deposits.

At the show, a sneak preview of the QX600 system and the subsequent AOI innovation of CyberOptics will be exhibited. Designed with a novel Strobe Inspection Module (SIM) with brilliant illumination by LED lighting and 12 µm higher resolutions, the QX600 ensures better solder joint and gold finger inspection, while minimizing shadow and reflection effects.

Furthermore, a prototype version of the QX100i system will also be featured at NEPCON.

Source: http://www.cyberoptics.com/

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