Feb 9 2009
Bookham, Inc. (NASDAQ: BKHM) has announced that its flagship high performance generation eight (G08) optical chip, designed for use in signal amplification in telecommunications networks, has achieved a combined total of 300 million field hours. The G08 chip is manufactured in the company's Zurich facility, and underpins the industry leading 750mW pump laser module and the OceanBright(TM) submarine pump.
The G08 chip has been an integral part of the Bookham portfolio of pump laser and amplifier products for four years. So far it has contributed 300 million of the 20 billion field hours generated by the broader Bookham pump portfolio, which has demonstrated a FIT (Failure in Time) rate of <15FITs in the terrestrial market. The chip is fully qualified to Telcordia requirements and beyond for both terrestrial and submarine applications.
The ultra high power 750mW pump laser module has been shipping in volume since March 2007, and offers amplifier designers the opportunity to replace two pump laser modules with one, improving cost, performance and enabling a reduced footprint. The module has the industry's widest operating temperature range at 750mW, from -20 degrees Celsius to +75 degrees Celsius, covering uncontrolled environments and central office under fault conditions. The module also boasts the lowest profile package available at just 7.6mm.
The Bookham ultra high reliability OceanBright pump has been shipping in volume to major tier one submarine equipment manufacturers since September 2007. The module is capable of exceeding 400mW at operating temperatures from 0 degrees Celsius to 45 degrees Celsius, and is the only submarine pump available in a small form factor Mini-DIL package.
"Bookham is leading the market with high performance pump laser modules, and that leadership is enabled by the quality of our G08 chip," said director of product management, Mark Ives. "Our 750mW pump laser module offers the highest power available, and combines that with the broadest operating temperature range and lowest profile package."