Nova Measuring Instruments has introduced a new technological innovation. By using this novel technology, chipmakers will be able to carry out expedite development and product achievement of multi-chip integrations based on TSVs (Through Silicon Vias).
Manufactured in partnership with leading device producers, the powerful new Nova V2600 TSV Metrology system will facilitate precise measurement of critical TSV features including bottom curvature, side-wall angle, and bottom diameter for the first time. This highly-reliable process control solution provides complete TSV dimensional metrology in a production-ready high-throughput system to support the industry's shift to 3D integration in production.
Nova created a number of novel technologies for this complicated application, thereby overcoming the barrier that prevented Optical CD methodology deployment on non-periodic structures. Based on a special patent pending optical configuration, Nova V2600 assembles a dark-field reflectometry spectrum having increased sensitivity to TSV internal structure variations. A unique, novel modeling engine has been developed. This engine has been demonstrated to be capable of translating this spectrum into precision via dimensions with the help of spectral fitting. In contrast to competing technologies based on resolution-limited optical imaging, this spectral method can be deployed for potential TSVs with diameters less than 5 µ.
Nova V2600 adapts with production-proven Nova Modular Metrology platform which includes two metrology units packed within a single compact frame. This high-throughput platform ensures high operational flexibility and superior cost of ownership.
Source: http://www.nova.co.il/