A digital imaging solutions provider, OmniVision Technologies has developed the OV8850 CameraChip sensor. It is an 8 megapixel CameraChip sensor based on OmniBSI-2 pixel architecture.
The 0.25-inch OV8850 sensor from OmniVision is 20% thinner than the standard 8 megapixel modules. This allows for design of thinner CMOS sensor-based smartphones. The 1.1 ì OmniBSI-2 pixel architecture provides better power efficiency and enhances image quality as compared to the previous 1.4 ì OmniBSI pixel.
The senior product manager of OmniVision, Per Rosdahl stated that the company has been able to miniaturize the pixel offering while increasing the quantum efficiency by 20% in the color channels. The company has also improved the low-light sensitivity by 35% and increased the full-well capacity by 45%.
The OV8850 CameraChip sensor features imaging functions such as two phase lock loops, on-chip temperature sensor, alternate row exposure for still image capture and HDR video and context switching.
It also features an integrated scaler, which enables 1080p/30 HD video in full field view and also provides adjustable resolution. A 2 X 2 binning feature allows 720p/60 HD video recording with electronic image stabilization, which is a popular feature in the next-gen mobile devices. The OV8850 can be accommodated in an 8.5 x 8.5mm autofocus camera module having a build height of 4.7 mm. Trialing will begin in August, with volume production anticipated in the first quarter of 2012.
Source: http://www.ovt.com